Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Zigmund Ramirez Camacho0
Abelardo Hadap Advincula, Jr.0
Henry Descalzo Bathan0
Lionel Chien Hui Tay0
Date of Patent
June 8, 2010
0Patent Application Number
120504280
Date Filed
March 18, 2008
0Patent Primary Examiner
Patent abstract
An integrated circuit package system comprising: forming a finger; forming a die pad adjacent the finger; applying a fill material around the finger and the die pad; forming a cavity in the finger and fill material; and attaching an integrated circuit die over the die pad adjacent the finger with the fill material.
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