Patent attributes
A microelectronic assembly and a method for forming the same are provided. The method includes forming first and second lateral etch stop walls (44, 46) in a semiconductor substrate (20) having first and second opposing surfaces (22, 24). An inductor (56) is formed on the first surface (22) of the semiconductor substrate (20) and a hole (60) is formed through the second surface (24) of the substrate (20) to expose the substrate (20) between the first and second lateral etch stop walls (44, 46). The substrate (20) is isotropically etched between the first and second lateral etch stop walls (44, 46) through the etch hole (60) to create a cavity 62) within the semiconductor substrate (20). A sealing layer (70) is formed over the etch hole (60) to seal the cavity (62).
