Patent attributes
A plated module is for an IC card and includes a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip intended to be hosted in a recess of a plastic support of the IC card. At least some of the conductive areas are connected to a corresponding contact points of the integrated circuit chip. At least some of the conductive areas are linked to corresponding extended areas by one or more bridges. The conductive areas are separated from the extended areas by an insulating channel crossed by the bridges. The insulating channels surround the conductive areas as a protection frame for the contact points. At least a major side of at least one of the conductive areas may be curved. Several of the advanced extended areas form a rounded border of the plated module.
