US Patent 7719108 Enhanced reliability semiconductor package
Patent 7719108 was granted and assigned to Lockheed Martin on May, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.
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Patent Inventor Names
David L. Vos0
Richard Shields0
Ryan S. Riegle0
William E. Murphy0
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Official Website
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US Patent 07719108 Enhanced reliability semiconductor package US Patent 7719108 Enhanced reliability semiconductor package
Infobox
Patent Number
077191080
Patent Number
77191080
Edits on 26 Apr, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
077191080
Date of Patent
May 18, 2010
0Patent Application Number
110325260
Date Filed
January 10, 2005
0Official Website
Patent Primary Examiner
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US Patent 07719108 Enhanced reliability semiconductor package
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07719108
Date of patent
May 18, 2010
Patent application number
11032526
Date Filed
January 10, 2005
Patent primary examiner
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