Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
You Yang Ong0
Heap Hoe Kuan0
Ma. Shirley Asoy0
Seng Guan Chow0
Dioscoro A. Merilo0
Date of Patent
May 18, 2010
0Patent Application Number
124094910
Date Filed
March 24, 2009
0Patent Primary Examiner
Patent abstract
An integrated circuit package-on-package stacking method includes forming a leadframe interposer including: forming a leadframe having a lead; forming a molded base only supporting the lead; and singulating the leadframe interposer from the leadframe.
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