Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tae Keun Lee0
Sangkwon Lee0
Date of Patent
May 11, 2010
0Patent Application Number
113076140
Date Filed
February 14, 2006
0Patent Primary Examiner
Patent abstract
A semiconductor package system includes providing a substrate having a plurality of thermal vias extending through the substrate. A solder mask is positioned over the plurality of thermal vias. A plurality of thermally conductive bumps is formed on at least some of the plurality of thermal vias using the solder mask. An integrated circuit die is attached to the plurality of thermally conductive bumps. An encapsulant encapsulates the integrated circuit die.
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