A method of making a light emitting diode includes forming a plurality of electrically conductive members at intervals on a first surface of an epitaxial layer which generates light so that the electrically conductive members are in ohmic contact with the epitaxial layer, forming a light incident layer on the first surface at regions where none of the electrically conductive members are formed, forming a light reflecting layer on the light incident layer and the electrically conductive members, providing an adhesive on the light reflecting layer, and bonding a permanent substrate to the light reflecting layer through the adhesive and through a wafer bonding process.