Patent 7705411 was granted and assigned to National Semiconductor on April, 2010 by the United States Patent and Trademark Office.
The bow in a wafer that results from fabricating a large number of MEMS devices on the top surface of the passivation layer of the wafer so that a MEMS device is formed over each die region is reduced by forming a stress relief layer between the passivation layer and the MEMS devices.