Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 27, 2010
Patent Application Number
11425817
Date Filed
June 22, 2006
Patent Primary Examiner
Patent abstract
High silicon-content resin composition that can be used to form thin film thermosets, useful in forming low k dielectric constant materials and as well as hard mask materials with anti-reflective properties for the photolithography industry are disclosed.
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