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US Patent 7704066 Heat insulating stamper structure

Patent 7704066 was granted and assigned to RICOH COMPANY,LTD. on April, 2010 by the United States Patent and Trademark Office.

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Patent abstract

A heat insulating stamper is disclosed. The heat insulating stamper includes an uppermost section made of a metal material, a lowermost section made of the same material as the uppermost section, and a middle section having a heat conductivity lower than the uppermost section. The middle section includes the same metal material as the uppermost section and the lowermost section, and heat insulating portions.

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Patent Inventor Names
Kazuhiro Kotaka0
Nobuhiro Tanaka0
Shigeru Fujita0
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US Patent 07704066 Heat insulating stamper structure US Patent 7704066 Heat insulating stamper structure

Infobox
Patent Number
077040660
Patent Number
77040660
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=077040660
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Infobox
Is a
Patent
Patent
0
Current Assignee
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
077040660
Date of Patent
April 27, 2010
0
Patent Application Number
105820180
Date Filed
October 19, 2005
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=077040660
Patent Primary Examiner
‌
Steven P. Griffin
0
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"Entity importer update"
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07704066
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 US Patent 07704066 Heat insulating stamper structure

Infobox
Is a
Patent
Patent
Current assignee
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07704066
Date of patent
April 27, 2010
Patent application number
10582018
Date Filed
October 19, 2005
Patent primary examiner
‌
Steven P. Griffin

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