Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tae Hyun Kim0
Dong Kuk Kim0
Sung Taek Kwon0
Tae Ha Lee0
Date of Patent
March 16, 2010
Patent Application Number
12232251
Date Filed
September 12, 2008
Patent Primary Examiner
Patent abstract
Provided is a system-in-package module including a system circuit board; a first element that is disposed on the system circuit board; a second element that is disposed on the first element so as to be shifted to one side from the center of the first element, while partially exposing the first element; a third element that is electrically connected to the system circuit board and is disposed on the second element; and a plurality of bump pads that are disposed on the bottom surface of the system circuit board.
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