Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jonathan Harris0
Michael A. Zimmerman0
Date of Patent
March 16, 2010
0Patent Application Number
119838130
Date Filed
November 9, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A microcircuit package having a ductile layer between a copper flange and die attach. The ductile layer absorbs the stress between the flange and semiconductor device mounted on the flange, and can substantially reduce the stress applied to the semiconductor device. In addition, the package provides the combination of copper flange and polymeric dielectric with a TCE close to copper, which results in a low stress structure of improved reliability and conductivity.
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