Patent attributes
A light source having a circuit carrier and a die is disclosed. The circuit carrier includes top and bottom conducting layers sandwiching an insulating substrate. The bottom layer has a first surface adjacent to the insulating substrate and a second surface includes a portion of a bottom surface of the light source, the substrate having a die bonding region in which the top conducting layer and a portion of the substrate are absent. A portion of the bottom conducting layer is present under the die bonding region and the die is bonded to the top surface of the bottom conducting layer in the die bonding region. The bottom conducting layer is patterned to provide first and second bottom electrodes that are electrically isolated from one another and connected to first and second contacts for powering the LED.
