US Patent 7675152 Package-on-package semiconductor assembly
Patent 7675152 was granted and assigned to Texas Instruments on March, 2010 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 1, 2005
Date of Patent
March 9, 2010
Patent Application Number
11217233
Patent Citations Received
Patent Inventor Names
Shawn Martin O'Conner
0
Mark Allen Gerber
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
Find more entities like US Patent 7675152 Package-on-package semiconductor assembly
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.