Patent attributes
A surface mount light emitting device includes a substrate, a chip set, a wire set and an encapsulator. The substrate includes a base plate with four corners and four electrode layers arranged on the corners, each electrode layer has a top electrode extended to the top surface of the base plate, a bottom electrode extended to the bottom surface of the base plate and a trace extended toward the center of the top surface of the base plate. The chip set includes two resistor chips and two light emitting chips, the resistor chips arranged on two of the traces extended from two diagonal corners, the light emitting chips respectively arranged on the other two traces extended from the other two diagonal corners. The wire set includes two fuse wires electrically connected the resistor chips to the light emitting chips. The encapsulator is encapsulating the chip set and the wire set.
