US Patent 7673386 Flip-chip component production method

Patent 7673386 was granted and assigned to Epcos Ag on March, 2010 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Epcos Ag

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7673386

Date of Patent

March 9, 2010

Patent Application Number

12277927

Date Filed

November 25, 2008

Patent Citations Received

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US Patent 11855608 Systems and methods for packaging an acoustic device in an integrated circuit (IC)

Patent Primary Examiner

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C. J. Arbes

Patent abstract

The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and the component chip and has a planar or planarized surface, so that it contacts closely to the bottom side of the component chip. Different covers are proposed for the additional encapsulation.