Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 2, 2010
Patent Application Number
12288624
Date Filed
October 22, 2008
Patent Primary Examiner
Patent abstract
A thermal module includes at least one heat dissipating element, at least one cooling chip, and a heat radiating unit. The cooling chip has a cold end in contact with one side of the heat dissipating element and a hot end in contact with the heat radiating unit. With the cooling chip in direct contact with the heat radiating unit and the heat dissipating element, the heat dissipating element can be directly cooled by the cooling chip, and the thermal module can have a simplified structure to occupy a reduced room while providing enhanced heat dissipating efficiency and accordingly upgraded heat-dissipating effect.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
