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US Patent 7664297 Three-dimensional joint structure measuring method

Patent 7664297 was granted and assigned to Teijin on February, 2010 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee
Teijin
Teijin
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
76642970
Patent Inventor Names
Yoshiaki Azuma0
Norihiro Yamada0
Tsutomu Maeda0
Yoshifumi Harada0
Date of Patent
February 16, 2010
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Patent Application Number
104756940
Date Filed
April 26, 2002
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Patent Citations Received
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US Patent D1009933 Display screen with epioscopy icon
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Patent Primary Examiner
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Vikkram Bali
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Patent abstract

A method enabling a destroyed part of a joint or joint cartilage to be extracted accurately and at a high speed with a good repeatability and enabling quantitative and simple 3D analysis of the joint and the destroyed part, that is, a method of 3D image processing comprising filling in a medullary cavity region, comprised of a hollow region inside a joint, of a digitalized image of a cross-section of the examined joint using the Expansion and Shrinkage method, performing 3D labeling by a 3D image obtained by stacking digitalized images of cross-sections of the examined joint generated at a step of extracting a contour of the cross-sectional image of the joint or digitalized images of cross-sections of the examined joint not pre-processed, and defining the joint image to be evaluated.

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