Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yukihiro Takao0
Koichi Kuhara0
Takashi Noma0
Yoshinori Seki0
Akira Suzuki0
Hiroshi Yamada0
Hiroyuki Shinogi0
Date of Patent
February 16, 2010
0Patent Application Number
114888900
Date Filed
July 19, 2006
0Patent Primary Examiner
Patent abstract
A glass substrate is bonded through a resin to the top surface of a semiconductor wafer on which a first wiring is formed. A V-shaped groove is formed by notching from the back surface of the wafer. A second wiring connected with the first wiring and extending over the back surface of the wafer is formed. A protection film composed of an organic resin or a photoresist layer to provide protection with an opening is formed on the second wiring by spray coating. A conductive terminal is formed by screen printing using the protection film as a solder mask. A cushioning material may be formed on the back surface of the wafer by spray coating.
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