Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 16, 2010
Patent Application Number
12030062
Date Filed
February 12, 2008
Patent Primary Examiner
Patent abstract
An apparatus of this invention includes: a workpiece holding mechanism that holds a ring frame and a wafer; a tape supplying device that supplies a continuous dicing tape or a continuous carrier tape to which a precut dicing tape is joined, to a joining position; a joining unit that joins the continuous dicing tape or the precut dicing tape separated from the carrier tape, to the ring frame and the semiconductor wafer; a tape cutting mechanism that cuts the dicing tape joined to the ring frame along a contour of the ring frame; and a residual tape collecting section that takes up and collects a residual tape after the cutting.
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