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US Patent 7659362 Metal-binding motif compositions and methods

Patent 7659362 was granted and assigned to Academia Sinica on February, 2010 by the United States Patent and Trademark Office.

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Patent
Patent
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Current Assignee
Academia Sinica
Academia Sinica
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
76593620
Patent Inventor Names
Cheng-Che Sage Kung0
Kuo-Chen Yeh0
Date of Patent
February 9, 2010
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Patent Application Number
114208810
Date Filed
May 30, 2006
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Patent Citations Received
‌
US Patent 12116420 Functionalizing biological substrates with bioengineered peptides to bind targeted molecules
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Patent Primary Examiner
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Chih-Min Kam
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Patent abstract

Disclosed herein are recombinant copper or zinc binding polypeptides containing at least one copper or zinc binding motif and a sequence heterologous to it. Also disclosed is a method to reduce the concentration of a free copper or zinc ion in a substrate by contacting it with a recombinant polypeptide containing a copper or zinc binding motif. A further method relates to reducing the concentration of a free copper or zinc ion in a substrate by contacting it with a host cell that expresses a recombinant polypeptide containing a copper or zinc binding motif.

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