Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
John Trezza0
Date of Patent
February 9, 2010
0Patent Application Number
116938510
Date Filed
March 30, 2007
0Patent Primary Examiner
Patent abstract
A method performed on a wafer having multiple chips each including a doped semiconductor and substrate involves etching an annulus trench, metalizing an inner and an outer perimeter side wall of the annulus trench, etching a via trench into the wafer, making a length of the via trench electrically conductive, thinning a surface of the substrate.
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