Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 9, 2010
Patent Application Number
11605831
Date Filed
November 27, 2006
Patent Primary Examiner
Patent abstract
A direct gold/silicon eutectic die bonding method is disclosed. The method includes the steps of gold plating a die bonding pad, grinding a wafer to a desired thickness, dicing the wafer after the grinding step, picking a die, and attaching the die to the die bonding pad at a temperature above the gold/silicon eutectic temperature. For thinner wafers, a dicing before grinding process is employed.
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