US Patent 7652373 Power delivery using an integrated heat spreader

Patent 7652373 was granted and assigned to Intel on January, 2010 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7652373

Date of Patent

January 26, 2010

Patent Application Number

11903862

Date Filed

September 24, 2007

Patent Primary Examiner

‌

Kevin M. Picardat

Patent abstract

An integrated heat spreader (IHS) having a groove and a cavity formed therein is disclosed. In one embodiment, the groove has an insulating layer formed therein, and a power conduit is mounted in the groove, the power conduit is electrically isolated from the IHS by the insulating layer, and the power conduit conducts a voltage relative to the IHS to deliver power to the cavity. In another embodiment, the IHS is soldered to a semiconductor die and a package substrate. In a further embodiment, the power conduit comprises an edge connector.