Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 26, 2010
Patent Application Number
12078107
Date Filed
March 27, 2008
Patent Primary Examiner
Patent abstract
A light-emitting diode (“LED”) package is disclosed. The LED package includes a substrate, a pad frame, an LED chip and a housing. The pad frame includes a conductive lead divided by insulation materials on the substrate. The LED chip is mounted on the conductive lead. The housing surrounds the LED chip and the conductive lead, and has opening recess exposing the LED chip and a part of the conductive lead. The conductive lead includes a protrusion extended in both directions substantially perpendicular to a longitudinal direction of the housing.
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