Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 19, 2010
Patent Application Number
11197360
Date Filed
August 5, 2005
Patent Primary Examiner
Patent abstract
Propagation of a crack in a semiconductor device is to be suppressed, thus to protect an element forming region. An interface reinforcing film is provided so as to cover a sidewall of a concave portion that penetrates a SiCN film and a SiOC film formed on a silicon substrate. The interface reinforcing film is integrally and continuously formed with another SiOC film, and includes an air gap.
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