Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rex W. Pirkle0
Sean M. Malolepszy0
Date of Patent
January 19, 2010
0Patent Application Number
114640800
Date Filed
August 11, 2006
0Patent Primary Examiner
Patent abstract
The present invention provides a process for manufacturing an integrated circuit (IC) package and an integrated circuit (IC) package. The process, without limitation, includes providing an integrated circuit chip having a configuration, and forming a layer of overcoat material over the integrated circuit chip based upon the configuration.
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