Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chok J. Chia0
Maurice O. Othieno0
Amar J. Amin0
Date of Patent
January 12, 2010
0Patent Application Number
113997230
Date Filed
April 6, 2006
0Patent Primary Examiner
Patent abstract
Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate which can have an integrated circuit die attached thereto. The package includes a dedicated high-speed ground plane that is electrically isolated from the ground plane used to ground the low speed circuitry of the package.
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