US Patent 7641966 Re-release adhesive and re-release adhesive sheet

Patent 7641966 was granted and assigned to Nitto Denko on January, 2010 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Nitto Denko

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7641966

Date of Patent

January 5, 2010

Patent Application Number

10013543

Date Filed

December 13, 2001

Patent Primary Examiner

‌

Susan W. Berman

Patent abstract

A curable re-release adhesive which, when subjected to a curing reaction caused by irradiation with radiation, shows a sufficient drop of adhesion and causes the adherend to be warped to a minimized extent as developed by the shrinkage force caused by the curing reaction. The re-release adhesive contains a radiation-reactive polymer including a main chain and a plurality of intramolecular side chains, each such side chain having a terminal carbon-carbon double bond, a chain length of 6 or more in terms of number of atoms, and the same or a different number of atoms as each other side chain in the polymer. The release adhesive shows a shrinkage force of 30 MPa or less as developed by a curing reaction upon irradiation. A re-release adhesive sheet is also disclosed, including a substrate film and an adhesive layer containing the re-release adhesive, provided on one surface thereof.