Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Houfei Chen0
Date of Patent
December 15, 2009
0Patent Application Number
113826680
Date Filed
May 10, 2006
0Patent Primary Examiner
Patent abstract
A structure and method for reducing the effects of chip-package resonance in an integrated circuit assembly is described. A series RLC circuit is employed to reduce the output impedance of the power delivery system at the resonance frequency.
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