US Patent 7632429 Method for molding disc substrate

Patent 7632429 was granted and assigned to Sony on December, 2009 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Sony

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

76324290

Patent Inventor Names

Yoshihito Fukushima0

Date of Patent

December 15, 2009

Patent Application Number

113261990

Date Filed

January 5, 2006

Patent Primary Examiner

‌

Mathieu D. Vargot

Patent abstract

Preventing a molded disc substrate from generating a separation pattern. To this end, a molding die 1 includes a pair of stationary die 6 and movable die 7, and an outer circumference ring 16 for molding an outer circumference end of the disc substrate 2. The outer circumference ring 16 is so mounted as to be movable along forward and backward directions in parallel with a moving direction of the movable die 7 toward the stationary die 6, and has a retaining surface 39 for retaining the outer circumference of the molded disc substrate 2.