Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasunari Ooyabu0
Jun Ishii0
Date of Patent
December 8, 2009
0Patent Application Number
118195960
Date Filed
June 28, 2007
0Patent Primary Examiner
Patent abstract
A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires arranged in mutually spaced-apart relation, and a plurality of semiconductive layers formed on the insulating layer and electrically connected to the metal supporting board and the respective wires. The semiconductive layers are provided independently of each other in correspondence to the respective wires.
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