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US Patent 7628309 Transient liquid phase eutectic bonding

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Date Filed
May 3, 2005
Date of Patent
December 8, 2009
Patent Application Number
11120879
Patent Citations Received
‌
US Patent 12087749 Display module and system applications
0
‌
US Patent 11894284 Semiconductor structure having silver-indium transient liquid phase bonding joint
0
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US Patent 11978825 LED with internally confined current injection area
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7628309
Patent Primary Examiner
‌
Jessica L Ward

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