Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tsukasa Tokida0
Date of Patent
December 1, 2009
0Patent Application Number
114482290
Date Filed
June 7, 2006
0Patent Primary Examiner
Patent abstract
In a light-emitting device, a mount member mounting a semiconductor light-emitting element is mounted on a circuit board. A multilayer board is used for the mount member. A first conductive pattern formed on the surface layer of the multilayer board and a semiconductor light-emitting element are electrically connected. On the multilayer board, a second conductive pattern formed on an intermediate layer positioned closer to the circuit board than the first conductive pattern is electrically connected to the conductor part of the circuit board with a conductive wire such as a gold wire. Power is fed from the conductor part to the semiconductor light-emitting element via the conductive wire and the conductive patterns.
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