Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 1, 2009
Patent Application Number
11806541
Date Filed
June 1, 2007
Patent Primary Examiner
Patent abstract
An interconnection process is provided. The process includes the following steps. Firstly, a semiconductor base having at least a electrical conductive region is provided. Next, a dielectric layer with a contact hole is formed to cover the semiconductor base, wherein the contact hole exposes part of the electrical conductive region. Then, a thermal process is performed on the semiconductor base covered with the dielectric layer. Lastly, a conductive layer is formed on the dielectric layer, wherein the conductive layer is electrically connected to the electrical conductive region through the contact hole.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
