US Patent 7622794 COL (Chip-On-Lead) multi-chip package
Patent 7622794 was granted and assigned to Powertech Technology on November, 2009 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 5, 2008
0
Date of Patent
November 24, 2009
0
Patent Application Number
12133892
0
Patent Inventor Names
Wen-Jeng Fan
0
Patent Jurisdiction
Patent Number
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