Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
IL Kwon Shim0
Dario S. Filoteo, Jr.0
Seng Guan Chow0
Tsz Yin Ho0
Date of Patent
November 24, 2009
0Patent Application Number
111637710
Date Filed
October 29, 2005
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are provided on the substrate, the solder separators having flattened tops at a predetermined height above the substrate. A die is supported on the solder separators above the substrate.
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