Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 17, 2009
Patent Application Number
11592427
Date Filed
November 3, 2006
Patent Primary Examiner
Patent abstract
An integrated circuit interconnect structure includes a conductive line, a first barrier layer disposed on a bottom surface of conductive line, a second barrier layer disposed on the top surface of the conductive line, and an interlevel dielectric surrounding the conductive line.
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