Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 10, 2009
Patent Application Number
11751440
Date Filed
May 21, 2007
Patent Primary Examiner
Patent abstract
A system to support a die includes a substrate. A solder resist is disposed over the substrate. A first solder bump is disposed in the solder resist to provide electrical connectivity through the solder resist to the substrate. A second solder bump is formed over the solder resist to correspond with a peripheral edge or a corner of the die. The second solder bump provides standoff height physical support to the die.
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