Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takeshi Matsumura0
Sadahito Misumi0
Yasuhiro Amano0
Tsubasa Miki0
Masami Oikawa0
Naohide Takamoto0
Date of Patent
November 3, 2009
Patent Application Number
12040775
Date Filed
February 29, 2008
Patent Primary Examiner
Patent abstract
The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and has a melt viscosity of 400 Pa·s or more and 2500 Pa·s or less at 100° C. before the film is thermally set.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
