Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 27, 2009
Patent Application Number
12078772
Date Filed
April 4, 2008
Patent Primary Examiner
Patent abstract
This semiconductor device includes a semiconductor chip, and a lead arranged around the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, and having at least an end farther from the semiconductor chip bonded to a package board, wherein a joint surface to the package board and an end surface orthogonal to the joint surface are formed on the end of the lead farther from the semiconductor chip, and a metal plating layer made of a pure metal is formed on the end surface.
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