Patent 7605473 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on October, 2009 by the United States Patent and Trademark Office.
Methods of fabricating nonvolatile memory devices are provided. An isolation layer is formed on a substrate. The substrate has a memory region and a well contact region and the isolation layer defines an active region of the substrate. A gate insulating layer is formed on the active region. The gate insulating layer is patterned to define an opening therein. The opening exposes at least a portion of the well contact region of the substrate and acts as a charge pathway for charges generated during a subsequent etch of the isolation layer. Related memory device are also provided.