Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 13, 2009
Patent Application Number
11275604
Date Filed
January 19, 2006
Patent Primary Examiner
Patent abstract
A method and semiconductor device. In the method, at least one partial via is etched in a stacked structure and a border is formed about the at least one partial via. The method further includes performing thick wiring using selective etching while continuing via etching to at least one etch stop layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
