Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 6, 2009
Patent Application Number
11426573
Date Filed
June 26, 2006
Patent Primary Examiner
Patent abstract
A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the cavities and is segmented around the cavities to form a plurality of cap structures. The cap structures are hermetically sealed to a device wafer to form hermetic windows over devices and pads located on the device wafer.
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