Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 29, 2009
Patent Application Number
11354124
Date Filed
February 15, 2006
Patent Primary Examiner
Patent abstract
An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device 100 includes a semiconductor chip 102 provided on a lead frame 121, which are encapsulated with an encapsulating resin 115. Lead frames 119 are provided in both sides of the lead frame 121. A portion of the lead frame 119 is encapsulated with the encapsulating resin 115 to function as an inner lead 117. The encapsulating resin 115 is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad 107 provided in the semiconductor chip 102 is electrically connected to the inner lead 117 via the AuPd wire 111.
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