US Patent 7592696 Power module having at least two substrates

Patent 7592696 was granted and assigned to Infineon Technologies on September, 2009 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Infineon Technologies

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

75926960

Patent Inventor Names

Wolfram Hable0

Date of Patent

September 22, 2009

Patent Application Number

116368360

Date Filed

December 11, 2006

Patent Primary Examiner

‌

Thien F. Tran

Patent abstract

The invention relates to a power module 3 and a method for producing it. The power module 3 has a first substrate 1 having power semiconductor chips 4, and a second substrate 2 populated with signal semiconductor chips 5. The substrates 1 and 2 are oriented parallel one above the other, their placement sides 7 and 8 being arranged facing one another, and the second substrate 2, with the aid of bonding wires 9 bent in hingelike fashion, being held at a defined distance d from the first substrate 1 and being mechanically fixed in a plastic housing 18 and electrically connected.