Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 15, 2009
Patent Application Number
12204502
Date Filed
September 4, 2008
Patent Primary Examiner
Patent abstract
A method for manufacturing a semiconductor device that includes a housing, formed of a polyamide-series thermoplastic resin, and a semiconductor package sealed in the housing, which is formed of a thermosetting epoxy resin. The surface of the package is modified by UV-irradiation to have adhesive properties to polyamide. A plurality of connector terminals extend from the package and housing in parallel. A portion of the terminals is also sealed in the housing together with the package. Thus, the device is easily produced by insert molding and has excellent moisture resistance.
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