Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Peter C. Salmon0
Date of Patent
September 8, 2009
0Patent Application Number
114959540
Date Filed
July 27, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method for building scalable electronic subsystems is described. Stackable modules employ copper substrates with solder connections between modules, and a ball grid array interface is provided at the bottom of the stack. A cooling channel is optionally provided between each pair of modules. Each module is re-workable because all integrated circuit attachments within the module employ re-workable flip chip connectors. Also, defective modules can be removed from the stack by directing hot inert gas at externally accessible solder connections.
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