Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 8, 2009
Patent Application Number
11541960
Date Filed
October 2, 2006
Patent Primary Examiner
Patent abstract
An electronic component for microwave transmission includes a high resistivity substrate on which is at least located several metallization layers divided into portions. A first set of piled up portions defines a ground ribbon and a second set of piled up portions defines a power ribbon. At least a first active portion of said ground ribbon and a first active portion of said power ribbon are respectively located between the substrate and an uppermost one of the several metallization layers. The electronic component in one implementation is a coplanar waveguide.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
