Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 18, 2009
Patent Application Number
11796297
Date Filed
April 27, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package structure and the methods for forming the same are provided. The semiconductor package structure includes an interposer; a first plurality of bonding pads on a side of the interposer; a semiconductor chip; and a second plurality of bonding pads on a side of the semiconductor chip. The first and the second plurality of bonding pads are bonded through metal-to-metal bonds.
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